01. Ɔde ne nsa kyerɛɛ ne so02. Ɔde ne nsa kyerɛɛ ne so03. Ɔde ne nsa kyerɛɛ ne so04. Ɔde ne nsa kyerɛɛ ne so05. Ɔde ne nsa kyerɛɛ ne so
P-2235-G2 na ɛwɔ hɔ
01. Ɔde ne nsa kyerɛɛ ne so
Sɛ́ adwumayɛfo a wɔyɛ adwuma titiriw wɔ R&D ne EMI kyɛm afã horow a wɔyɛ no pɛpɛɛpɛ mu no, yɛde ahantan de P-2235-G2 Through-hole Shielding Cover no fi ase. Saa Shielding Cover a ɛyɛ adwuma yiye yi wɔ porous structure sɛ ne mfaso titiriw, na ɛma wiase nyinaa ɛlɛtrɔnik mfiri no nya ano aduru a wɔaka abom a ɛka ɔhyew a wɔsɛe no yiye ne electromagnetic ahobammɔ bom, na edi amannɔne ɛlɛtrɔnik mfiri a ɛkorɔn a wɔde di dwuma ho ahwehwɛde a emu yɛ den no ho dwuma pɛpɛɛpɛ.
Wɔde ntokuru a ɛyɛ pɛpɛɛpɛ a ɛyɛ den a ɛyɛ pɛpɛɛpɛ a wɔakyekyɛ no pɛpɛɛpɛ ahyɛ saa Shielding Cover yi mu wɔ ne soro. Wɔnam electromagnetic ne thermal simulations nyinaa so na ɛyɛ tokuru no gyinabea yie, na ɛhwɛ ma EMI shielding a ɛyɛ adwuma yie a ɛsi abɔnten electromagnetic interference ne emu signal leakage kwan yie wɔ 100MHz kɔ 10GHz frequency band no so. Saa bere yi nyinaa, ɛma ɔhyew a ɛtwetwe akwan a ɛdɔɔso ma PCB afã horow a ɛwɔ ade no mu, na esiw adwumayɛ a ɛsɛe anaasɛ mfiri no nyin a ɔhyew a ɛboaboa ano de ba no ano, na ɛma ɛyɛ nea eye ma ahoɔden a ɛkorɔn, a wɔaka abom kɛse wireless nkitahodi ne mfiridwuma sohwɛ module ahorow.
Wɔde ntokuru a ɛyɛ pɛpɛɛpɛ a ɛyɛ den a ɛyɛ pɛpɛɛpɛ a wɔakyekyɛ no pɛpɛɛpɛ ahyɛ saa Shielding Cover yi mu wɔ ne soro. Wɔnam electromagnetic ne thermal simulations nyinaa so na ɛyɛ tokuru no gyinabea yie, na ɛhwɛ ma EMI shielding a ɛyɛ adwuma yie a ɛsi abɔnten electromagnetic interference ne emu signal leakage kwan yie wɔ 100MHz kɔ 10GHz frequency band no so. Saa bere yi nyinaa, ɛma ɔhyew a ɛtwetwe akwan a ɛdɔɔso ma PCB afã horow a ɛwɔ ade no mu, na esiw adwumayɛ a ɛsɛe anaasɛ mfiri no nyin a ɔhyew a ɛboaboa ano de ba no ano, na ɛma ɛyɛ nea eye ma ahoɔden a ɛkorɔn, a wɔaka abom kɛse wireless nkitahodi ne mfiridwuma sohwɛ module ahorow.
01. Ɔde ne nsa kyerɛɛ ne so
Sɛ́ Through-hole Shielding Cover no, ne core through-hole pin design ma wotumi fa through-hole soldering kɔ PCB no so. Sɛ wɔde toto atetesɛm so surface-mount shielding covers ho a, ɛma mfiri nkitahodi a ɛyɛ den kɛse, ɛma zero detachment ne cold solder joints mpo wɔ high-vibration tebea horow te sɛ kar ne mfiridwuma mu dwumadie mu, bere a ɛhwɛ hu sɛ asase so loop kɔ so ma shielding no mudi mu kura ne signal stability kɔ so yɛ kɛse.
Wɔde aduru a ɛho tew kɛse a ɛma nsu fa mu (kɔbere-nickel aduru anaa tin-plated cold-rolled steel optional), a wɔayɛ denam pɛpɛɛpɛ stamping ne eco-friendly electroplating akwan so. Tin/nickel plating a ɛwɔ soro no ma corrosion resistance ne solderability yɛ kɛse. Wobetumi ayɛ aperture, spacing, ne layout a porous structure no customized sɛnea customer ahwehwɛde, flexiblely kari pɛ ɔhyew dissipation efficiency ne shielding etu mpɔn.
Wɔde aduru a ɛho tew kɛse a ɛma nsu fa mu (kɔbere-nickel aduru anaa tin-plated cold-rolled steel optional), a wɔayɛ denam pɛpɛɛpɛ stamping ne eco-friendly electroplating akwan so. Tin/nickel plating a ɛwɔ soro no ma corrosion resistance ne solderability yɛ kɛse. Wobetumi ayɛ aperture, spacing, ne layout a porous structure no customized sɛnea customer ahwehwɛde, flexiblely kari pɛ ɔhyew dissipation efficiency ne shielding etu mpɔn.
01. Ɔde ne nsa kyerɛɛ ne so
Wɔde saa Shielding Cover yi di dwuma kɛse wɔ wireless communication modules, IoT smart gateways, kar ECUs, industrial control motherboards, ne mfuw afoforo mu, na edi amannɔne adetɔfo ahwehwɛde kɛse a ɛfa nnwinnade a ɛyɛ den, ɔhyew a wɔsɛe no yiye, ne electromagnetic a ɛne ne ho hyia ho dwuma. Yɛboa tape-and-reel packaging a ɛne SMT automated assembly hyia, a sɛ wɔde through-hole pin design no ka bom a, ɛma wotumi yɛ nhyiam no yiye na ɛtew adwumayɛfo ka so ma amannɔne nneɛma a wɔyɛ no. ISO9001 quality management system no gyina akyi, na ade no anya amanaman ntam adansedie te sɛ CE, FCC, ne RoHS. Yɛde nsusuiɛ, tokuru nsusuiɛ, nneɛma, ne ɔfasuo ayaresa a wɔahyɛ da ayɛ ma, na ɛboa adeyɛ no nyinaa firi nhwɛsoɔ nhwɛsoɔ so kɔsi unit ɔpepem pii a wɔyɛ no dodoɔ so.
Ɛnam ɔhyew a wɔsɛe no ho mfaso a ɛwɔ ne porous nhyehyɛe no so, mfiridwuma mu ahotoso a ɛwɔ through-hole nhyehyɛe no mu, ne wiase nyinaa ɔsom nhyehyɛe nti, P-2235-G2 Through-hole Shielding Cover abɛyɛ Shielding Cover ano aduru a amannɔne ɛlɛtrɔnik adwumayɛfo pɛ, na ɛboa adetɔfo ma wɔma nneɛma no adwumayɛ ne gua so akansi kɔ anim.
Ɛnam ɔhyew a wɔsɛe no ho mfaso a ɛwɔ ne porous nhyehyɛe no so, mfiridwuma mu ahotoso a ɛwɔ through-hole nhyehyɛe no mu, ne wiase nyinaa ɔsom nhyehyɛe nti, P-2235-G2 Through-hole Shielding Cover abɛyɛ Shielding Cover ano aduru a amannɔne ɛlɛtrɔnik adwumayɛfo pɛ, na ɛboa adetɔfo ma wɔma nneɛma no adwumayɛ ne gua so akansi kɔ anim.

